High Bandwidth Memory (HBM)

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   Micron opens second Taiwan advanced packaging and test plant (AATT2)

   Micron held a ceremony in Taichung on Oct. 15 to mark the start of operations at Micron Advanced Assembly and Test Taiwan 2 (AATT2), its second advanced packaging and testing plant in Taiwan, which the company says will strengthen its advanced packaging and test capacity for high bandwidth memory (HBM) and AI-driven demand. In its latest earnings report, Micron said most of its 2027 HBM capacity is already booked by customers and expects HBM demand growth to keep outpacing conventional DRAM through 2028, while its HBM advanced packaging plant in Singapore is expected to start contributing capacity from 2027. Attendees included President Lai Ching-te, Economics Minister Kung Ming-hsin, Micron president and COO Manish Bhatia, Micron Taiwan chairman Lu Tung-hui, and customers and ecosystem partners such as Asus, MSI and MediaTek.

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