HengHan Microelectronics

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   HengHan Micro raises nearly RMB 100M angel round for 400G RDMA smart NICs

   In August 2026, Chengdu-based AI networking chip startup HengHan Micro said it closed a nearly RMB 100 million angel round led by a group of Chinese investors including Beijing Guotai, Chengdu Sci-Tech Investment, Chengdu Hi-tech Venture Investment and CITIC Juxin Investment, with proceeds going to product iteration, hiring and market expansion. Its first product, a 400G RDMA smart NIC, has completed sampling and validation and received formal orders, with initial customers being small and mid-sized model training/inference firms and AI token factories; the card uses an FPGA design for faster market entry. The company claims its in-house RDMA architecture with credit-based proactive congestion management achieved dynamic latency one-half to one-third that of NVIDIA's comparable CX-7 in some test scenarios, and plans to move to in-house ASIC chips for next-generation 800G and 1.6T cards.

   创业邦 科技 · 🔥 9

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