FOMS

Headlines · 1

1. Oct 23
   Biwin Storage Advances Wafer-Level Advanced Packaging for AI

   Biwin Storage said it is accelerating its strategy combining storage solutions with wafer-level advanced packaging and testing, including faster construction of advanced-packaging manufacturing facilities. The company is advancing R&D and industrialization of FOMS, CMC and OEC technologies for advanced storage, integrated memory-compute packaging and high-speed optoelectronic interconnection. Biwin also said it intends to expand into AI computing-infrastructure markets, which it believes will create medium- and long-term storage opportunities.

   36氪快讯 · 🔥 0

Experience and discussion from the community

Share my FOMS experienceAsk about FOMS