Biwin Storage
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Headlines · 4
- A-share Q3 Earnings Show AI Computing Leads Sector Growth
TMTPost reports that 5,572 A-share listed companies generated 56.65 trillion yuan in revenue and 5.10 trillion yuan in attributable net profit for the first three quarters of 2026, increases of 5.42% and 7.76%, respectively. It attributes the information technology sector’s 31.95% revenue growth and 140.25% profit growth mainly to the AI computing supply chain, particularly memory and chip companies, while noting that third-quarter overall profit fell 11.02%. The broader report also identifies sharply contrasting sector performance, including material-sector growth and a combined 53.187 billion yuan loss for real estate companies.
钛媒体 · 🔥 10 - Biwin Storage reports sharp profit growth for first nine months of 2026
Biwin Storage reported first-nine-month revenue of RMB21.717 billion, up 230.30% year over year, and attributable net profit of RMB8.768 billion, up 28,728.12%. Non-GAAP net profit reached RMB8.467 billion, compared with a loss in the prior-year period. For the third quarter alone, revenue was RMB6.142 billion and attributable net profit was RMB1.602 billion.
36氪快讯 · 🔥 0 - Biwin Storage Reports Strong Growth in 2026 First Nine Months
Biwin Storage reported 2026 first-nine-month revenue of RMB 21.717 billion, up 230.3% year over year, and attributable net profit of RMB 8.768 billion. For the third quarter, revenue reached RMB 6.142 billion and attributable net profit RMB 1.602 billion, while operating cash flow for the first nine months was negative RMB 10.041 billion due to increased operating procurement spending. The company reported RMB 4.823 billion in revenue from its ePOP edge-storage products and said they have been used in AI or AR glasses and smartwatches, though the product revenue and customer adoption claims were not independently verified in the supplied report.
IT之家 AI · 🔥 0 - Biwin Storage Advances Wafer-Level Advanced Packaging for AI
Biwin Storage said it is accelerating its strategy combining storage solutions with wafer-level advanced packaging and testing, including faster construction of advanced-packaging manufacturing facilities. The company is advancing R&D and industrialization of FOMS, CMC and OEC technologies for advanced storage, integrated memory-compute packaging and high-speed optoelectronic interconnection. Biwin also said it intends to expand into AI computing-infrastructure markets, which it believes will create medium- and long-term storage opportunities.
36氪快讯 · 🔥 0
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