Faraday Technology Wins U.S. Customer AI Chip Design
Faraday Technology said it secured an important AI chip design win for an undisclosed U.S. customer, setting company records in design process, design complexity, NRE spending and advanced packaging. The vendor said the cloud-oriented chip supports FP64 computing, uses Samsung Foundry’s 2nm process, vertically stacks a logic SoC with custom DRAM through hybrid bonding, and supports PCIe Gen6. According to Faraday Technology, the customer had planned to use a 4nm process but selected this design based on performance and power considerations.
The project combines an advanced foundry process, hybrid-bonded custom DRAM and AI/HPC-oriented capabilities in a cloud chip design secured by Faraday Technology.
IT之家 10 月 28 日消息，芯片 IP 与设计服务企业智原科技 (Faraday Technology) 昨日在企业 2026Q3 财报中宣布获得美国客户重要开案，设计制程、设计复杂度、NRE 金额、先进封装均创下公司记录。
IT之家获悉，这是一款面向云端的 AI 芯片，同时支持 FP64 计算（应兼顾 HPC 任务）。其基于三星晶圆代工 2nm 先进制程，将逻辑 SoC 与定制 DRAM 垂直堆叠，应用混合键合技术，支持 PCIe Gen6。智原提到，客户原计划使用 4nm 工艺，但在性能和功耗的考虑下选择了该方案。
智原科技 2026Q3 合并营收 36.6 亿新台币（IT之家注：现汇率约合 7.5 亿元人民币），同比 +13%、环比 +11%；毛利率 42.5%、营业利润率 5.8%。