AMD EPYC Verano 将采用全新 SB1 插槽
据散热器厂商 Dynatron 的产品页信息，AMD 面向 AI 服务器的 EPYC 9006 系列“Verano”处理器将使用全新的 SB1 插槽，需要与其它 Zen 6 EPYC 不同的散热方案。报道称 Verano 最多 72 个 Zen 6 核心、频率可达 5 GHz，并配备 24 通道 LPDDR5X 内存子系统，采用可更换的 SOCAMM2 模块；AMD 计划于 2027 年下半年推出。
这说明面向 AI 加速器的专用主机 CPU 正走向定制化插槽与固定配置，类似 Nvidia Grace 的思路。
AMD's upcoming EPYC 9006-series 'Verano' CPUs that are specifically designed for AI servers will use an all-new SB1 socket and will require different cooling systems than other processors in the lineup, according to a listing at Dynatron, a leading maker of server coolers, discovered by InstLatX64. The new SB1 socket will be smaller than SP7 and SP8 sockets for other Zen 6-based EPYC CPUs and will therefore have different power and cooling needs.
AMD's Verano is quite different from conventional EPYC processors. The CPU will feature up to 72 Zen 6 cores operating at up to 5 GHz and a massive 24-channel LPDDR5X memory subsystem that uses replaceable SOCAMM2 modules. AMD positions Verano as a host processor for AI servers, where CPUs primarily orchestrate workloads running on AI accelerators rather than provide maximum general-purpose performance themselves. Such specialization could explain why AMD developed SB1 instead of using SP7, which accommodates up to 256-core EPYC 'Venice' processors, or SP8, designed for models with up to 128 cores. Meanwhile, AMD has not disclosed SB1's specifications, dimensions, or capabilities just yet.