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Headlines · 2

1. Oct 23
   RISC-V summit shows automotive gains, AI software gaps

   The sixth RISC-V China Summit opened in Shenzhen on October 19, hosted by RIOS Lab, with discussions spanning automotive chips, AI, data centers, software, and chip design. TMTPost reported that automotive RISC-V had reached concrete production milestones: Zijing Semiconductor said its Zijing M100 automotive MCU entered vehicle production on December 18, 2025, while Changsha Evening News reported that the company’s automotive-chip shipments exceeded 10 million units. AI and data-center presentations focused on instruction-set extensions, processor cores, IP, and software stacks, but did not provide public deployment, customer, or shipment figures.

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2. Oct 9
   Global AI Chip Summit 2026: from TOPS to tokens as agents reshape silicon

   The 2026 Global AI Chip Summit in Shanghai brought together more than 60 speakers across an opening session and three forums on large-model AI chips, agent inference chips and embodied-intelligence chips, focused on the computing chain from TOPS to tokens — covering architecture innovation, 3D stacking and near-memory compute, KV cache, new memory types, compute-in-memory, analog computing, RISC-V and token-factory operations. Several vendors used the stage to preview or detail products: Houmo AI said its M50 chip has reached 150+ design wins in half a year of mass production and that its next flagship A20 has taped out; Intel previewed a high-density cabinet with 128 or 192 Granite Rapids processors that it says can run 50,000 concurrent agents; Maitech said its 3D TPU has taped out and is expected back in November. Those figures are vendor claims and have not been independently verified.

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