Iluvatar CoreX

Headlines · 5

1. 14h
   Chinese GPU makers race on supernodes as buyers weigh cost and ecosystem

   At the 26th China International Industry Expo, where the integrated-circuit zone debuted as a standalone exhibition, domestic GPU vendors focused on rack-scale "supernodes": MetaX showed its 64-GPU fully interconnected Xijing S600 plus a 16-GPU S600 Lite, Enflame showed the Yunsui ESL64-O built with ZTE, and Iluvatar CoreX packed 144 GPUs and 18 CPUs into one 44U rack, saying the TianGai 300 IXL144 reaches 100-nanosecond single-hop latency and a 15% effective bandwidth gain in certain MoE All-to-All scenarios (all vendor claims). Citing an IDC report via Reuters, the article says China's data-center AI accelerator shipments reached 2.008 million units in the first half of 2026, with Nvidia at 678,000 (34%) and Huawei at 572,000 (28%), while China GPU shipments fell 26% year on year to 991,000 units and other AI accelerator types rose nearly 80% to 1.016 million. The report argues that beyond performance and price, stable supply, software ecosystem maturity and the ability to bring real customers and revenue to compute centers will shape commercialization, with vendors ultimately answering how to lower customers' total cost of ownership.

   36氪 人工智能 · 🔥 7
2. 5d
   Iluvatar CoreX unveils TianGai 300 IXL144 rack with 144 GPUs

   At the 2026 China International Industry Fair, Iluvatar CoreX launched what it calls the industry's highest-density single-rack supernode, the TianGai 300 IXL144, packing 144 GPUs and 18 CPUs into one cabinet. The system is compatible with CUDA and other AI ecosystems so customers can reuse existing models and frameworks to cut migration and deployment costs, and uses high-bandwidth whole-rack interconnect to form a unified memory-semantics compute domain for more efficient large-model training and inference. Iluvatar CoreX estimates the cost per million effective tokens is 40% lower than mainstream international solutions, a vendor figure.

   36氪快讯 · 🔥 0
3. 6d
   Biren plans HK$4.02B placement, total raise hits HK$17.26B

   Biren Technology announced on Oct. 8 a placement of 130 million H shares at HK$31.8 apiece to no fewer than six placees, about 4.76% of post-issue share capital, for estimated net proceeds of roughly HK$4.02 billion. The price was a 9.76% discount to the previous close, and the stock fell 11.85% to HK$30.36 that day, closing at HK$31 on Oct. 9 for a market value of about HK$80.6 billion. Including a roughly HK$6.204 billion net raise at its January listing and a HK$7.038 billion placement in July, Biren has raised about HK$17.261 billion (about RMB 14.7 billion) since listing, the most among listed Chinese GPU makers. The company says about 70% of this round goes to strategic supply-chain procurement, production preparation and commercialization for its next-generation flagship BR20X, which it benchmarks against NVIDIA's H200 and expects to enter post-tape-out validation and customer testing in Q4, with large-scale deployment in 2027.

   钛媒体 · 🔥 0
4. 7d
   Huawei says Ascend tops Nvidia in China share as supply stays tight

   According to a media briefing summary published by Jiemian, Huawei rotating chairman Xu Zhijun said Ascend is still far from meeting domestic demand and that Huawei has no plan to expand broadly overseas, urging the supply chain to "go faster, produce more"; he said Huawei's own data suggests Ascend's China market share has surpassed Nvidia's, though the note gave no figure or methodology. Nvidia said in its quarterly report that H200 shipments to some Chinese customers permitted since February accounted for less than 1% of data center revenue in the quarter, and it excluded China data center compute revenue from next-quarter guidance. The article also reports intent prices for Ascend 950DT accelerator cards up 20%-50% in two months to over 250,000 yuan and 950PR up from about 60,000 yuan early this year to over 80,000 yuan (intent quotes, not final prices), and that DeepSeek published Ascend-targeted software components including TileKernels and DeepGEMM-Ascend on September 30.

   虎嗅 AI · 🔥 0
5. Oct 9
   Global AI Chip Summit 2026: from TOPS to tokens as agents reshape silicon

   The 2026 Global AI Chip Summit in Shanghai brought together more than 60 speakers across an opening session and three forums on large-model AI chips, agent inference chips and embodied-intelligence chips, focused on the computing chain from TOPS to tokens — covering architecture innovation, 3D stacking and near-memory compute, KV cache, new memory types, compute-in-memory, analog computing, RISC-V and token-factory operations. Several vendors used the stage to preview or detail products: Houmo AI said its M50 chip has reached 150+ design wins in half a year of mass production and that its next flagship A20 has taped out; Intel previewed a high-density cabinet with 128 or 192 Granite Rapids processors that it says can run 50,000 concurrent agents; Maitech said its 3D TPU has taped out and is expected back in November. Those figures are vendor claims and have not been independently verified.

   品玩 实时要闻 · 🔥 0

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