HBM5

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   Samsung lays out AI memory roadmap: speed, scalability, persistence

   Samsung Electronics unveiled its next-generation memory strategy at the Open Compute Project (OCP) Global Summit in California, naming speed, scalability and persistence as its three pillars. The company said that as AI models keep growing, memory capacity expansion and data storage technology have become as critical as memory bandwidth. Its plans include HBM5, custom HBM, zHBM and processing-in-memory (PIM) for throughput, CMM-D and CXL-based products for capacity expansion, and next-generation SSDs, QLC and flexible data placement for storage. Samsung also showed ecosystem work: Groq chips manufactured on its 4nm process plus the Groq 3 LPX system with Nvidia, and a CXL-based memory expansion solution demonstrated with AMD.

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